Engineered Polymer Formulations , Thermoplastic Elastomers , Consumer Electronic Accessories | Consumer Products , Ebooks , Electrical + Electronics Navigating the Challenges of Semiconductor Packaging with Specialty Polymer Solutions Navigating the Challenges of Semiconductor Packaging with Specialty Polymer Solutions

They are custom engineered to meet specific performance requirements: core thickness can be varied to change stiffness, core materials can be selected to achieve weight targets, fiber choice can modify stiffness-to-weight ratio, and the polymer matrix choice affects strength. Navigating the Challenges of Semiconductor Packaging with Specialty Polymer Solutions Navigating the Challenges of Semiconductor Packaging with Specialty Polymer Solutions

FOR MEDIA USE ONLY: To download a high-resolution image, please click here: For Media Use Only Avient Announces Quarterly Dividend... Avient Board of Directors Appoints Ashish K.

As a result, the demand for high quality rPET packaging has never been greater.  ColorMatrix Amosorb 4020R has been formulated to address this performance issue, and is the latest in a portfolio of solutions Avient has developed to enable high-quality recycled packaging. FOR MEDIA USE ONLY: To download a high-resolution image, please click here: FOR MEDIA USE ONLY

THE SOLUTION Maintaining high organoleptic standards while easing processing windows can be difficult. When closurelogic turned to Avient for material selection help, the team developed a GLS™ TPE (thermoplastic elastomer) based on a stable, low migration TPE with a lower processing temperature compared to competitive TPEs, thus resulting in even fewer volatiles. Lower processing temperature was another key for this application—this saves energy and makes start ups or conversions faster, generating less waste.

Avient Announces Quarterly Dividend... Avient Board of Directors Appoints Ashish K. Avient Announces First Quarter 2025 Results...

Drying non-halogenated materials is suggested. 2 hours @ 100 (38) Moisture Range (%) Not required Vents should be placed at the intersection of each 90° bend in the runner system off of the cold slug well and vented to atmosphere PROBLEM CAUSE SOLUTION Black Specks Contamination • Purge barrel with general purpose PP • Verify correct nozzle is being used • Pull screw for cleaning Degraded/overheated material • Decrease melt temperature • Decrease back pressure • Decrease injection speed • Use appropriately sized barrel Brittleness Degraded/overheated material • Decrease melt temperature • Decrease back pressure • Decrease injection speed • Use appropriately sized barrel Gate location and/or size • Relocate gate to nonstress area • Increase gate size to allow higher flow rate and lower molded-in stress Burning Process related • Decrease nozzle and barrel temperatures • Decrease mold temperature • Decrease injection rate Mold design • Clean, widen and increase number of vents • Increase gate size to reduce shear Fibers/Minerals on Surface or Uneven Surface Appearance Melt temperature too low • Increase melt temperature • Increase mold temperature • Increase injection speed Insufficient packing • Increase hold pressure and time • Increase shot size Flash Injection pressure too high • Decrease injection pressure • Increase clamp pressure • Decrease injection rate • Increase transfer position Excess material volume • Adjust transfer position • Decrease pack pressure • Decrease shot size • Decrease injection rate Melt and/or mold too hot • Decrease nozzle and barrel temperatures • Decrease mold temperature • Decrease screw speed Loose clamp • Reset mold height • Increase clamp tonnage Troubleshooting Recommendations PROBLEM CAUSE SOLUTION Incomplete Fill Melt and/or mold too cold • Increase nozzle and barrel temperatures • Increase mold temperature • Increase injection rate Mold design • Enlarge or widen vents and increase number of vents • Check that vents are unplugged • Check that gates are unplugged • Enlarge gates and/or runners • Perform short shots to determine fill pattern and verify proper vent location • Increase wall thickness to move gas trap to parting line Shot size • Adjust transfer position to 98% full • Increase shot size Nozzle Drool Nozzle temperature too hot • Decrease nozzle temperature • Decrease back pressure • Increase screw decompression Shrink Too much shrink • Increase cooling time • Decrease mold temperature Too little shrink • Decrease cooling time • Increase mold temperature Sink Marks Part geometry too thick • Reduce wall thickness • Reduce rib thickness Melt too hot • Decrease nozzle and barrel temperatures • Decrease mold temperature Insufficient material volume • Adjust transfer position • Increase shot size • Increase injection rate • Increase packing pressure Troubleshooting Recommendations (continued) PROBLEM CAUSE SOLUTION Sticking in Mold Overfilled cavity • Decrease injection rate and pressure • Decrease hold pressure • Adjust transfer position • Decrease nozzle and barrel temperatures • Decrease mold temperature • Decrease cooling time Mold design • Increase draft angle • Polish cores in direction of ejection Part is too hot • Decrease nozzle and barrel temperatures • Decrease mold temperature • Increase cooling time Warp Process related • Increase cooling time • Increase melt temperature • Increase pack pressure • Increase pack time • Decrease mold temperature Mold design • Inspect for non-uniform mold cooling Part design • Inspect for non-uniform wall thickness Temperature control unit incorrect temperature • Check settings • Inspect thermocouple Weld Lines Melt front temperatures are too low • Increase pack and hold pressure • Increase melt temperature • Increase injection rate • Increase mold temperature Mold design • Increase gate size • Perform short shots to determine fill pattern and verify proper vent location • Add vents and/or false ejector pin • Move gate location 1.844.4AVIENT www.avient.com Copyright © 2022, Avient Corporation. Avient makes no warranties or guarantees respecting suitability of either Avient’s products or the information for your process or end-use application.

Hydrocerol plays a critical role in an Avient-wide program to support a sustainable plastics industry. Navigating the Challenges of Semiconductor Packaging with Specialty Polymer Solutions Navigating the Challenges of Semiconductor Packaging with Specialty Polymer Solutions

Avient Employees Share Inspiring Sustainability Stories How Avient Innovation Enables Sustainability I am inspired to be leading Avient's talented team of 9,300 employees, upholding high standards of environmental stewardship, social responsibility, and ethical governance."

Avient makes no representations, guarantees, or warranties of any kind with respect to the information contained in this document about its accuracy, suitability for particular applications, or the results obtained or obtainable using the information. Avient makes no warranties or guarantees respecting suitability of either Avient’s products or the information for your process or end-use application. AVIENT MAKES NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, either with respect to the information or products reflected by the information.